Foxconn: Completes Roof Installation and Weathertight Enclosure of the Company’s Nearly One-Million-Square-Foot Advanced Manufacturing Facility

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Milwaukee, WI – Foxconn Technology Group (Foxconn) and its construction manager Gilbane|Exyte today announced that as of the new year building enclosure is substantially complete for weather protection for the nearly one-million-square-foot advanced manufacturing facility at the Wisconsin Valley Science and Technology Park (WVSTP). 

“Thanks to the hard work of the Gilbane|Exyte team, along with dozens of Wisconsin companies and their employees, Foxconn is able to celebrate this significant milestone,” said a Foxconn spokesperson. “Building enclosure being substantially complete for weather protection meets our year-end goal that began with an aggressive construction schedule. As Foxconn heads in 2020, the company will play an important role in Wisconsin’s development as a global technology hub that will drive further investment and job creation.”

Foxconn has awarded approximately $370 million to date in total contract value for work at the WVSTP. Nearly 8,000 tons of American steel was fabricated and installed, and more than 500 truckloads transporting supplies were used for the roof construction. Full and complete enclosure of the advanced manufacturing facility will continue through the beginning months of 2020. 

Information regarding these scopes of work and all current bid opportunities for the overall project, as well as previous bid awards for work at the WVSTP to-date can be found at: https://wisconnvalley.wi.gov/Pages/ScienceTechPark.aspx.

Businesses interested in applying for competitive bid packages with Mortenson for Foxconn’s Smart Manufacturing Center (SMC) and High-Performance Computing Data Center (HPCDC) are asked to visit wisconnvalley.wi.gov for upcoming opportunities and to register at https://bit.ly/2k9Qn5V.